Advanced Packaging Market Set to Grow at 10% CAGR Through 2033

The global advanced packaging market is projected to grow significantly from USD 56,511.60 million in 2024 to USD 1,33,251.39 million by 2033, at a robust compound annual growth rate (CAGR) of 10% during the forecast period of 2025-2033. Overview Advanced packaging technology has become a cornerstone of semiconductor manufacturing, evolving beyond its traditional purpose of protecting individual chips to include innovative techniques that integrate multiple interconnected chips. With increasing demand for high device density within compact footprints, advanced packaging plays a pivotal role in enabling functionality for modern electronics, including smartphones and autonomous vehicles. Wafer-level packaging (WLP) has emerged as a critical innovation, enabling integrated circuit packaging directly at the wafer level, delivering near-original die sizes with enhanced performance. Free Sample Report + All Related Graphs & Charts : https://straitsresearch.com/report/ad...